ASSEMBLY PROCESSES

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Flip chip (also known as direct chip attach) is the process whereby a semiconduc...

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Wafer Sawing is the process of singulating the wafer into individual die ready f...

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Pick and Place Alter Technology (formerly Optocap), has the capability to pick...

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Die Bonding Services Die bonding is the process of attaching a die to substrate...

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Wire bonding is the main method of making interconnections between a semiconduct...

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Au stud bumping requires no Under Bump Metalization (UBM) or special wafer prepa...

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Optocap’s expertise and capability in Encapsulation and Hermetic Sealing will re...

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Optical Alignment by Optocap with an extensive experience in aligning and attach...