Destructive Physical Analysis DPA
Is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.
PHOTO: Hybrid device after the opening process
In a DPA parts are examined for a wide variety of design, workmanship, and processing problems which may not show up during the previous inspection, test and screening activities performed by the component manufacturer. Anomalies and defects which are detected through DPA could, at some later date, cause degradation or failure of the system in which the devices are to be employed. DPA is conducted on samples taken randomly from the lot and consists of a series of various tests and inspections depending on the type of the component and package. Among them:
- X-ray Examination
- External Visual Inspection
- Seal tests (Fine& Gross leaks)
- Particle Impact Noise Detection (P.I.N.D)
- Internal Visual Inspection
- Bond Pull
- Scanning Electron Microscope (SEM)
- Die Shear
PHOTO: RF filter failure detected during the internal visual inspection which is a part of the cross sectioning process.
PHOTO: SEM inspection of metallization after removing the glassivation.
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