Destructive Physical Analysis DPA

Destructive Physical Analysis DPA

Is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.

DPA Hybrid device

PHOTO: Hybrid device after the opening process

In a DPA parts are examined for a wide variety of design, workmanship, and processing problems which may not show up during the previous inspection, test and screening activities performed by the component manufacturer.  Anomalies and defects which are detected through DPA could, at some later date, cause degradation or failure of the system in which the devices are to be employed.  DPA  is conducted on samples taken randomly from the lot and consists of a series of various tests and inspections depending on the type of the component and package. Among them:

  • X-ray Examination
  • External Visual Inspection
  • Seal tests (Fine& Gross leaks)
  • Particle Impact Noise Detection (P.I.N.D)
  • Solderability
  • Internal Visual Inspection
  • Bond Pull
  • Scanning Electron Microscope (SEM)
  • Die Shear

rf cross sectioning process

PHOTO: RF filter failure detected during the internal visual inspection which is a part of the cross sectioning process.

The DPA process can be performed in accordance with MIL-STD-883, MIL-STD-750, and MIL-STD-1580.

SEM inspection of metallization

PHOTO: SEM inspection of metallization after removing the glassivation.


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