Optocap also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including;
- CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
- QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA
This fast-turn assembly service offers customers a number of significant advantages;
- Fast-turn around – same day delivery possible
- Flexibility to handle last minute changes and accommodate non-standard die/wire bond layouts.
- No minimum order quantities
- Open Cavity Plastic Package benefits;
- Duplicates production package performance
- Remolding option
- Eliminates special socket requirements
- Accurate performance evaluation/validation of simulations and electrical parameters.
Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to the assembled product.
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