Technical Publications, Hi Rel Components, EEE Parts, Testing & Lab.

Since the Industry 4.0 concept was introduced into the market, factories and manufacturing processes have experienced different transformations to make them smarter, by linking various up to now isolated disciplines, from design to production, automa...

Flip chip assembly techniques bring a wide range of benefits: A reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better...

This study aims to support the development of discrete European radiation hardened SiC power MOSFET for use in space applications by means of studying the gate oxide in terms of SEE and TID as one of the key parameters in the future development of th...

The new century brought to the space a new type of solar cells with higher efficiencies and better resistance to radiation damage such as those based on the III-V single-junction GaAs. This new material opened the possibility of further improvement b...

The objective of this activity is to examine the suitability of solid state fiber optic switches to meet future space applications and define a complete technology development and space qualification roadmap for the most suitable solid state optical...

The use of differential (or balanced) digital and analog circuits for information processing has increased in recent years . When transmitting high-speed electrical signals, both the electromagnetic (EM) fields generated by the transmitted signals an...

Surface contamination involving micrometric particles, microbiological agents, molecular adsorbate and others, represent a significant hazard in many areas of industry. For instance, a high level cleanliness is a critical requirement that any EEE dev...

The procurement, evaluation, screening and lot acceptance of RF devices in leadless SMD packages to be used in spacecraft applications show unexpected difficulties whenever degolding or retinning processes are required. This is associated to the indu...

A compact balanced-to-balanced diplexer composed of two balanced bandpass filters is proposed in this letter. The balanced filters are implemented using compact edge-coupled square split-ring resonators. The design methodology is based on the standar...

New space missions include more extreme requirements of storage and operational temperatures and vacuum conditions exceeding standard -55ºC / +125ºC conditions Miniaturization implies increase higher power dissipation and hence max junction and PCB t...

For decades, military/space electrical, electronic, and electromechanical (EEE) parts have proved to be suitable for use in military and space applications. [NASA's Office of Safety & Mission Assurance (OSMA) evaluates newly available and advanced el...

Traditionally ASICs (and FPGAs) used in space were manufactured using Rad-Hard technologies and designed with special libraries. AS CMOS Technologies became denser (beyond the 180 nm node) it was realized that it was no longer affordable to change t...

Passive liquid crystal (LC) devices are becoming an interesting alternative for the manufacturing of photonic devices in spatial applications. These devices feature a number of advantages in this environment, the lack of movable parts, and of exposed...

1. Admissible methods for SEE testing were determined on accounts of their realization at Roscosmos Test Facilities. 2. The SEE Testing Aids (based on ions, proton and laser sources) were created and are currently in operation. 3. The Roscosmos Tes...

Many basic testers availables which offer the capability to carry out a test in a rather short delay (a few weeks) at a relatively low cost. Capability to develop on demand test setup for complex devices (μP High frequency devices, RF fixtures etc…)...

Radiation sensitivity of GaAs components is not really well known, compare to other technologies. Traditional radiation harness policy consisted in a good derating in DC bias conditions to ensure operation inside a known or expected DC safe operating...

New failure modes not observed in Silicon appear while testing SiC MOSFET and Schottky diodes and under heavy ions radiation. Gate damage in transistors remains undetected even monitoring drain current and gate leakage of the transistor under high vo...

Goal of the study • Propose a DD test standard • Should be available by the end of the year after ESA and Components Technology Board (CTB)/Radiation Working group (RWG) comments • Goal of this presentation ⇒ Not a draft of the future guidelines...

In order to evaluated the displacement damage on device induced by energetic particles in space, various device samples including optocouplers, solar cells, and bipolardisplacement damage radiation testing ransistors are irradiated with protons, neu...

Electronics systems designed for applications in high radiation environments, such as space missions, high energy accelerators and avionics, are subject to a radiation qualification process at component level which is often time consuming and expensi...

Accelerators are the accepted method to validate a device to flight. In vivo testing is a complex and expensive task that is needed to get information about how failures can propagate to primary outputs and monitor that the response of a design is co...