The Structure of Microelectronics

The best of microelectronics packaging and interconnection technologies

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.

EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16^th to 19^th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space, and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.

EMPC-2019 Technical Programme 

During the two days of the conference, the technical programme offers different visions of the field of microelectronics and packaging, taught by excellent authors from all over the world, from industry to academia. This will be a strong and international Technical Program:

• MEMS
• Reliability & Quality
• Substrate Technologies
• Posters academic and commercial Set-up and Presentations
• Interconnection Technologies
• Exhibitor presentations
• Manufacturing Technologies
• Advanced Packaging for Electronics & Photonics
• Power & Thermal Management
• Green Electronics
• Nano  Technologies
• Exhibitor presentations
• Applications
• Embedded Electronics & Smart Textiles
• Modelling

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