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IMPACT-IAAC 2019

Wednesday, October 23, 2019 - 8:00 am / Friday, October 25, 2019 - 5:00 pm CEST

IMPACT 2019

14th International Microsystems, Packaging, Assembly and Circuits Technology Conference

IMPACT-IAAC 2019 Conference, which is organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year will be held in conjunction with TPCA SHOW 2019 on Oct. 23th-25th at Taipei Nangang Exhibition Center. For grasping the latest trend, the symposium highlights the theme “IMPACT-IAAC on 5G-Evolution& Revolution.” The emergence of the fifth generation of mobile communications with its emphasis on massive MIMO and channel bandwidths over 1 GHz at mmWave frequencies is set to change everything we used to know about the design, validation, and operation of cellular systems.

IMPACT-IAAC 2019 looks at the technical implications of the validation of cellular systems and in particular, the necessity of moving to radiated testing of systems where beam-steered antenna arrays are used at both ends of the link is highly dynamic 3D fading environments. Credible solutions need to be found urgently for the timescales for the proposed deployment of 5G in 2020 are to be realized.

IMPACT-IAAC 2019 arrange plenary speeches, special sessions, invited talks, industrial sessions, posters, and outstanding paper presentations. Furthermore, IMPACT-IAAC Conference keeps collaborating with international organizations such as ICEP from Japan and iNEMI from the U.S.A.

Scope of paper solicited

The scope is encouraged to submit but not limited to. In this occasion are separated into two groups, Packaging and PCB

Packaging

  1. Advanced Packaging Technologies
  2. Power Electronics Packaging
  3. 3D Integration and SiP
  4. Wearable Technologies
  5. Interconnections & Nanotechnology
  6. Modeling, Simulation & Design
  7. Thermal Management
  8. Advanced Sensor & Microsystems Technology (MST)
  9. Advanced Materials, Automatic Process & Assembly
  10. Emerging Systems Packaging Technologies

PCB

  1. Advanced and Green Materials and Process
  2. Test, Quality, AOI, Inspection and Reliability
  3. HDI and Embedded Technology
  4. Electro Deposition and Electrochemical Processing Technology
  5. Mechatronics and Automation

This post is also available in: Spanish

Details

Start:
Wednesday, October 23, 2019 - 8:00 am
End:
Friday, October 25, 2019 - 5:00 pm
Event Category:
Event Tags:
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Website:
http://www.impact.org.tw/

Venue

Nangang Exhibition Center
No. 1, Jingmao 2nd Road, Nangang District
Taipei City, Taipei City 115 Taiwan
+ Google Map
Phone:
+886 2 2725 5200
Website:
https://www.tainex1.com.tw/zh-tw/

This post is also available in: Spanish