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Sunday, September 1, 2019
Euromat 2019, the European Congress and Exhibition on advanced materials and processes, is the premier international congress in the field of materials in Europe and the venue will be the Stockholm City Conference Centre.Find out more »
Leading passive components manufacturers will discuss their hot products, application notes and latest technology during the Advanced Passive Components Workshop as part of the upcoming 2nd PCNS Passive Components Networking Symposium on 11th September 2019 in Bucharest, Romania.
Attendees to the next 2nd PCNS Symposium will get a unique chance to meet experts from leading passive manufacturers AVX, Kemet, KOA Europe, Murata and Wuerth Elektronik and discuss the hot topics during a four-hour workshop dedicated to latest passive components and its applications.
PCNS is an international bi-annual networking symposium dedicated purely to passive components hosted by a European university. The 2nd PCNS venue will be held on September 10-13th 2019 in Bucharest, Romania hosted by a local Politehnica University of Bucharest.Find out more »
The Holm conference provides a forum for the presentation and discussion of the latest developments in the field of electric contacts and the application of recent advances in materials and processes in electric, electronic and telecommunication equipment.Find out more »
Radiation and its Effects on Components and Systems European Conference The RADECS Conference is the annual European scientific and industrial forum on the effects of radiation effects on electronic and photonic materials, devices, circuits, sensors and systems where scientists and engineers exchange on the latest progress and result about: Radiation Environments Radiation effects modeling, from materials to device, circuit and system level Test facilities & dosimetry Radiation hardness assurance Hardening and mitigation solutions Applications & case studies RADECS 2019 will…Find out more »
During the two days of the conference, the technical programme offers different visions of the field of microelectronics and packaging, taught by excellent authors from all over the world, from industry to academia. This will be a strong and international Technical Program:Find out more »
OHB and ESA organize the 18th European Symposium on Space Mechanisms and Tribology.
The symposium will host space mechanism professionals and industry leaders from around the world. Recognized as the main vehicle for Mechanism Engineers, experienced and new recruits, to come together to discuss and celebrate their successes and lessons learned, with a view to pooling their knowledge for the betterment of this unique community and the European space industry as a whole.Find out more »
European Symposium on Reliability of Electron Devices, Failure Physics & Analysis This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials, devices, and circuits for micro-, nano-, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications. Hosting ESREF 2019 in this rich environment is a great opportunity since reliability in these particular applications is a very…Find out more »
THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. The Workshop will again present the state-of-the-art concerning the investigation of thermal issues in electronic components and systems.Find out more »
The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2019 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session.Find out more »
Thursday, October 3, 2019
EDPS is considered a workshop. Copies of the proceedings are given to participants and posted on the web, but they are not part of the “literature.” so authors can publish the same material again at DAC, TCAD or other IEEE conferences or publications.Find out more »