Failure Analysis Electronic Parts | OPTOCAP

Once a product has been design and prototype devices manufactured customers will typically want to ensure that the design, materials and assembly processes are fit for purpose. This will typically involve putting the parts through some level of environmental and functional testing. After this stage it is important that any failure modes are identified and understood and feedback quickly to the design and process stages.

Failure Analysis

optocap failure analysis

Optocap offers Microfocus Xray service to enable an understanding of design and process improvements. Click below for more information on:

Microfocus Xray

Inspection tool for failure analysis or quality control
5kg sample weight; 50cm height limit
Real-time; 0-450 any view, 360° around position; 4um resolution

Optocap’s Microfocus Xray capability is used for a wide variety of failure analysis applications including;

  • Die Attach/Area void percentage calculation
  • BGA Analysis including diameters, void percentages, area, roundness
  • Assessment of open and shorts
  • Wire bond analysis
  • Component distance measurements

Additionally Optocap failure analysis services such as:

Scanning Electron Microscopy (SEM)
Energy Dispersive Spectroscopy (EDS)
Fourier Transform Infra-Red Spectroscopy (FT-IR)
Secondary Ion Mass Spectrometry (SIMS)
X-ray Photoelectron Spectroscopy (XPS)

optocap logo

This post is also available in: Spanish