Flip chip assembly techniques bring a wide range of benefits: A reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better electrical performances... Continue reading
The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components. This also entails a close collaboration between the manufacturing and... Continue reading
Laser Diode Packaging and Fiber Alignment The purpose of packaging for a laser diode is four-fold. Firstly, it provides electrical interconnection for the laser diodes, photodiodes, thermo-electric coolers, and any other components, to the outside world. Secondly, it provides an... Continue reading
This study aims to support the development of discrete European radiation hardened SiC power MOSFET for use in space applications by means of studying the gate oxide in terms of SEE and TID as one of the key parameters in the future development of these devices. The resistance... Continue reading
The new century brought to the space a new type of solar cells with higher efficiencies and better resistance to radiation damage such as those based on the III-V single-junction GaAs. This new material opened the possibility of further improvement by the development of the... Continue reading
Optical & Electrical parameters; Characterization of SiC JFET & MOSFET; Prototyping and Characterisation of Radiation Hardened SIC MOS Structures; Photonic parts in Mars exploration related programmes; Continue reading
New test methodologies: Combined Vacuum Temperature and Motion; Combined strain and extreme temperature; Combined radiation and cold temperature Continue reading
Very Extreme temperature Testing Parts: Assessment of surrounding passive parts; Development of specific parts; Development of specific parts Continue reading
Bakeout and very Extreme temperature Testing Facilities; The updated facilities comprises: 8 cryogenic chambers with a temperature range from -195ºC to +400ºC and ramps up to 40ºC/min. Dimensions up to 90x50x35cm. Continue reading
The objective of this activity is to examine the suitability of solid state fiber optic switches to meet future space applications and define a complete technology development and space qualification roadmap for the most suitable solid state optical switch technology for future... Continue reading
The use of differential (or balanced) digital and analog circuits for information processing has increased in recent years . When transmitting high-speed electrical signals, both the electromagnetic (EM) fields generated by the transmitted signals and the ground plane return... Continue reading
Surface contamination involving micrometric particles, microbiological agents, molecular adsorbate and others, represent a significant hazard in many areas of industry. For instance, a high level cleanliness is a critical requirement that any EEE device has to fulfil at any... Continue reading