Laboratory Services Brouchures

Capabilities

  • Screening, plan preparation and engineering support.
  • Initial and Final Customer Source Inspections(Pre-cap and Buy-Off inspections with worldwide presence: anytime, anywhere).
  • DPA (Destructive Physical Analysis).
  • LAT (Lot Acceptance Test), QCI (Qualification Conformance Inspection).
  • Constructional analysis, reverse engineering.
  • Evaluation analysis on commercial parts for space suitability.
  • Failure analysis investigation.
  • Authenticity test; Counterfeit investigation.
  • Thermal characterization.
  • Repacking.
  • Element evaluation (on hybrid add-on parts).
  • Storage with special conditions (hot & cold, dry atmosphere with nitrogen, etc).
  • Dice managing, inspection and storage.
  • Relifing Inspection.
  • Specific training.

Capabilities

  • Visual inspection at high and low magnifications (x1 to x1450).
  • Dice Inspection at high and low magnifications (x1 to x1450).
  • Radiographic inspection in real time 2D / 3D.
  • Marking permanence (resistance to solvents test).
  • External visual inspection with scanning electron microscope (SEM) using low vacuum capability (x8 to x20.000).
  • PIND test (Particle Impact Noise Detection) up to 2000 G and 250 Hz.
  • Real-time radiographic inspection with 3D computerized tomography and virtual micro-sectioning capabilities.
  • SAM (Scanning Acoustic Microscopy). A, B & C modes with acoustic tomography 3D rebuild.
  • Seal (fine and gross leaks).
  • Lock-in thermography for assembled boards, components, dice and active metallization. Fast response thermograph, up to 200Hz.
  • Lead material verification: lead-free avoidance for space suitability. Prohibited materials analysis.
  • Material analysis (EDX and XRF options available).

Capabilities

  • Internal visual inspection at low and high magnification (x1 to x700).
  • De-capping: manual or automatically controlled chemical etching with copper protection function.
  • FIB (Focused Ion Beam) for die micro-sectioning, with microanalysis mapping.
  • Cross-sectioning on passive parts and assembled PCB for soldering analysis.
  • SEM I – SEM II / FIB inspections, including EDX micro-analysis mapping.
  • Plasma etching (for glassivation removal).
  • Lid torque.
  • Bond pull. Bond shear. Die shear. Substrate attach strength.
  • Lead fatigue.
  • Dye penetrant.
  • Solderability and wetting balance test.
  • Terminal strength up to 50 Kg.
  • Material strength up to 2000 Kg (tensile and compressive).
  • Mating and un-mating force for connectors. Contact retention test. Contact engagement and separation force.
  • Endurance test for connectors, switches, relays.
  • Vibration.
  • Mechanical shock.
  • Infrared spectroscopy (Transmission mode in KBr pellets, Attenuated Total Reflectance (ATR) & Infrared Microscopy).

Capabilities

  • Burn-in and life test with biasing and environmental real-time monitoring. Nitrogen atmosphere (optional).
  • Temperature cycling (+300 ºC to -185 ºC with 45 ºC/min temperature ramps).
  • Thermal shock (+300 ºC to -185 ºC with 45 ºC/min temperature ramps).
  • Plastic package preconditioning (baking).
  • Hot and cold storage with monitored RH conditions.
  • Salt atmosphere testing.
  • HAST (pressure cooking).
  • Humidity test 85/85.
  • Moisture resistance test.

Capabilities

  • Development of complete test solutions (hardware & software) for our in-house Testing equipment.
  • Electrical test support for Digital, Analog and Mixed Signal devices.
  • ASIC design support (no licence ownership, VPN).
  • FPGA and embedded systems programming.
  • Electronic system design failure analysis.
  • Complex Circuit Schematic Design.
  • PCB layout design for RF microwave, high speed digital, analog, environmental test and complex solutions (up to 16 layers).
  • Power and signal integrity layout simulation.
  • PCB assembly and verification.
  • 3D Mechanical design.

Capabilities

  • Qualification Bare PCB:
    • Dimensional measurements
    • Microsectioning
  • Qualification assembled PCB:
    • Temperature cycling
    • Vibration test
    • Microsectioning analysis
  • Press-fit connector Qualification:
    • Temperature cycling
    • Vibration test
    • Microsectioning analysis
  • Wire crimping Evaluation
  • Component microsectioning analysis

Acreditation:

  • Qualification assembled PCB testing processes accredited ISO/IEC 17025 for:
    • ECSS-Q-ST-70-38
    • ECSS-Q-ST-70-08C

Capabilities

  • Power characterization of RF/MW devices up to 50 GHz.
  • Temperature characterization of RF/MW devices up to 50 GHz.
  • Screening and Life testing of RF/MW devices up to 50 GHz.
  • Characterization on LCR devices up to 3 GHz.
  • Non-destructive test fixture design and manufacturing for RF/MW devices up to 50 GHz.
  • Design and manufacturing of RF boards with precise impedance adjusting.
  • Design and manufacturing of fixed circuit impedance adaptors (up to 50 GHz).
  • Design of RF/MW filter (up to 50 GHz).
  • Design and manufacturing of customized calibration kits for high frequency devices (up to 50 GHz).
  • Dynamic impedance adaptation using RF tuners (up to 8 GHz).
  • Signal Noise measurement on high frequency devices (up to 50 GHz).
  • Characterization of RF/MW multiport devices (up to 50 GHz).
  • Verification of dimensions and material roughness analysis of RF/MW boards and waveguide.

Capabilities

  • Small leakage current measurement (fA).
  • Measurement and testing of magnetic devices.
  • Measurement and testing of high power passive and discrete devices.
  • Measurement of high speed and precision converters A/D & D/A up to 24 bits.
  • Measurement of 1024 I/O digital devices up to 1 Gb/s.
  • Mixed signal ASIC measurement.
  • High precision oscillators with low phase noise measurement.
  • Dielectric withstanding voltage up to 12 KV.
  • High power discrete devices.

Capabilities

  • T.I.D. (Total Ionizing Dose) over:
    • Materials
    • Individual components
    • Complete boards
    • Systems and equipments
  • S.E.E. (Single Event Effects).
    • S.E.U. (Single Event Upset).
    • S.E.L. (Single Event Latch-up).
    • S.E.T. (Single Event Transient).
    • S.E.B. (Single Event Burn-out).
    • S.E.G.R. (Single Event Gate Rupture).
    • S.E.D.R. (Single Event Dielectric Rupture).
    • S.H.E. (Single Event Hard Error).
    • S.E.F.I. (Single Event Functional Interrupt).
    • S.E.S.B. (Single Event Snap Back).
    • S.E.D. (Single Event Disturb).
  • Proton and neutron testing:
    • S.E.E. and D.D. (Displacement Damage).
    • A.S.E.R. (Accelerated Soft Error Rate Test).

Capabilities

  • ALTER’s own radiation laboratory: RADLAB.
  • Full availability 24/7 having the most advanced tester just where the irradiation lab is located, the electrical measurements can be done with no delay, minimizing thus TDE (Time Dependent Effects).
  • In-flux testing option is available.
  • Wide range of dose rates from (0 to >100 krad(Si)/h).
  • Elevated & Cryogenic temperature irradiation, in accordance with MIL-STD-883 Test Method 1019.
  • High uniformity irradiation test areas available (uniformity > 99%). Minimum uniformity of radiation field (>90%) guaranteed for all test areas.
  • Exhaustive, remote monitoring of ambient conditions (pressure, temperature and humidity), dose rate, accumulated dose and biasing conditions.
  • More than 27 years of cumulated experience in radiation.
  • All test aspects managed during the whole process (boards design & manufacturing, testing, measurement, reporting, etc)

Acreditation:

  • Radiation testing processes accredited ISO/IEC 17025 for:
    • ESA SCC 22900.
    • MIL-STD-883 T.M. 1019.
    • MIL-STD-750 T.M. 1019.
  • Audited DLA MIL, NASA and ESA for “Laboratory Suitability for all Defense Logistics Agency’s radiation test methods”.
  • Submitted to an ESA dosimetry intercomparison exercise.

Capabilities

  • Analysis and review of customer requirements and preparation of PA and safety plan
  • Providing engineering support to all activities, verifying compliance to Product Assurance requirements
  • Technologies and Parts selection to meet the customer/project requirements
  • Generation, review, discussion and approval of DCLs, PADs, specifications, technical notes and associated support documentation for compliance to project requirements.
  • Generation, review, discussion and approval of evaluation, qualification, LAT, DPA, QCI, RVT and upscreening plans and any reports which may be necessary for PAD approval/fulfilment or project requirements.
  • Technology and product assurance assessment based on mission profile, from COTS to class 1 projects
  • Audits and inspection at manufacturers and supplier premises as part of valuations, Precap and buy-off inspections
  • Review of radiation documents and test plans
  • Preparation and management of RFWs/RFDs, NCRs and participation in NRBs/MRBs
  • Alert and Obsolescence Management
  • Organization and attendance to PCBs/ERCBs
  • Technical support and review for radiation analysis, WCA, thermal analysis and further EIDP documents related to EEE parts
  • Chasing actions to close them

Capabilities

  • Sine vibration
  • Random Vibration
  • Sine on random vibration
  • Random on random vibration
  • Electrical monitoring during mechanical tests
  • Classic mechanical shock
  • SRS shock
  • Product qualification
  • ​Product certification
  • Quality assurance
  • Accelerated life test
  • Prototype evaluation
  • Mechanical interfaces design and FEM analysis
  • Fixing tools manufacturing and validation for test

Acreditations:

  • ​Qualification assembled PCB testing processes accredited ISO/IEC 17025 for:

ECSS-Q-ST-70-38
​ECSS-Q-ST-70-08C