Loading Events

← Back to Events

EPS IEEE Electronics Packaging Society

https://eps.ieee.org/

Wednesday, October 23, 2019

IMPACT-IAAC 2019

Wednesday, October 23, 2019 - 8:00 am / Friday, October 25, 2019 - 5:00 pm CEST
Nangang Exhibition Center, No. 1, Jingmao 2nd Road, Nangang District
Taipei City, Taipei City 115 Taiwan
+ Google Map
IMPACT 2019

IMPACT-IAAC 2019 Conference, which is organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year will be held in conjunction with TPCA SHOW 2019 on Oct. 23th-25th at Taipei Nangang Exhibition Center. For grasping the latest trend, the symposium highlights the theme “IMPACT-IAAC on 5G-Evolution& Revolution.”

Find out more »

Monday, November 18, 2019

IEEE CPMT Symposium Japan 2019

Monday, November 18, 2019 - 8:00 am / Wednesday, November 20, 2019 - 5:00 pm CET
Kyoto University Clock Tower Centennial Hall, 36 Yoshidahonmachi
Sakyo Ward, Kyoto 606-8317 Japan
+ Google Map
IEEE CPMT Symposium Japan 2019

“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE EP Society and has been held annually in Kyoto in November. The conference originally started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to “ICSJ” in 2010. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

Find out more »

Monday, December 16, 2019

EDAPS 2019

Monday, December 16, 2019 - 8:00 am / Wednesday, December 18, 2019 - 5:00 pm CET
THE GRAND HILAI HOTEL, No. 266號, Chenggong 1st Road
Kaohsiung City, Qianjin District 801 Taiwan
+ Google Map
EDAPS 2019

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package, and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization.

Find out more »
+ Export Events