Optical design Optocap

Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity.

optical design optocap

Optical Design

Optocap’s optical design capabilities are rooted within the laser and photonics industries.

Our capabilities range from the simple selection of a ball lens for coupling the output of an optical fibre into a photodiode, to providing a much wider module design service. This may include proof-of-concept design evaluation, opto-mechanical and thermal tolerancing leading to material selection, and the generation of mechanical piece part drawings through the use of Solidworks. In addition, in collaboration with established optical component providers, we can asses the merits of stock verses custom optics for your design solutions.

optoelectronic optical packaging

We use Zemax Engineering Edition throughout for all optic modeling requirements, and will make use of Sequential, Non-sequential or Wave Propagation techniques, depending upon your application requirements.

zemax optocap

Current applications include,

TO-can photodiode pigtails
TO-can VCSEL laser pigtails
Fibre coupling to laser diodes (free-space multi-lens as well as fibre lens)
Free-space optical isolator modules
Littrow spectrometer module
Laser diode beam propagation and shaping
Optical fibre delivery systems
Fibre coupling calculations (single-mode and multi-mode)
Custom lens design

Package Design and Modelling

Understanding the required environmental operating conditions, thermal, optical, mechanical and electrical requirements are the key to any successful package design activity.

Optocap utilize Design for manufacturing techniques to ensure that any designs are compatible with a low cost, high yield assembly process.

Thermo-mechanical finite element modelling will be used at the front end of the package design to assess the mechanical design positional stability and the component temperature gradients over package temperature exposures and device thermal loading. This activity will drive the definition and design of the package, layout of components, material selections and thickness for resistance to thermal gradient warpage, heat-sinking and cooling options, and appropriate joining materials to ensure expansion matching of materials. Optical modeling software will be used to define aspects of the module performance and its sensitivity to the positional placement of the components.

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Optocap
icon_house_blue Bain Square, Livingston EH54 7DQ,
United Kingdom
 +44 1506 403550
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