Die Bonding Services Die bonding is the process of attaching a die to substrate/package. Selection of the optimal die attach material and process is based on a number of issues including thermal requirements, electrical requirements and mechanical stability. Continue reading
Tag - epoxy die attach
Epoxy die attach is the most commonly used die attach process (remember die or chip to a substrate, package or another die).
In comparison to eutectic die attach, because of material costs and process, it is a more cost-effective solution. Applications used for epoxy die attach include simple transistors, encapsulation of wire bonds, LED attachment, MCMs and hybrids.
Optocap
