High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness... Continue reading
Pad Cratering One of the major failure modes encountered in PCB assembly is Pad cratering. This term is coined to describe a fracture at the pad/resin interface (adhesive failure) or within the resin beneath pads (cohesive failure) that extend along the whole pad length (see the... Continue reading
In Alter Technology micro-sectioning is accomplished in a specifically dedicated laboratory and by ESA certified staff on PCB/SMD inspection. ESA selects those laboratories that according to the higher quality standards are recommended to perform such operations on SMT/PCB... Continue reading
Plated Through Vias (PTV) are critical elements in PCB systems and special care must be paid during their inspection in order to ensure the reliability, as they are one the main factors that determine the PCB Quality. The functionality and reliability of PTVs are dictated by:... Continue reading
Thermomechanical stress in PCB/PWBs is generated by the mismatch between the coefficient of thermal expansion (CTE) of the materials comprising the system. In general laminate material used for PCB fabrication, as well as other dielectric polymers, have larger CTE than metal... Continue reading
Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension. Due to the key role played, they are required to have high durability even under harsh operating conditions. In the case of unexpected/early... Continue reading
Improper degree of compression: Stress relaxation, Improper crimping, Diagnosis tools and Inspection conducted in Alter Technology laboratories. Continue reading
Crimped connectors are gas-tight junctions ideally protected against environmental contaminants and corrosive agents. Nonetheless inappropriate crimping and inherent connector and wire defects reduce this protection. Thus, depending of the storage atmosphere, non-conducting... Continue reading
Electrothermal event refers to abnormal temperature increase leading to malfunction or catastrophic fails. The high temperature reached during such event activates or initiates some of the failure mechanism explained before, such as the growth of insulation oxide layers and... Continue reading
Crimping together with wire wrapping and spring clip systems are the preferred alternatives for the solderless connection of electrical conductors. In particular, crimped connectors offer several advantages such as: Gas-tightness and protection against oxidation and corrosive... Continue reading
The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components. This also entails a close collaboration between the manufacturing and... Continue reading
X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the... Continue reading
