Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts
Non-destructive detection of micrometric internal features within EEE microelectronic systems.
Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.
Acoustic Inspection of Hybrid Systems on Laminated Substrates
Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique.
Water ingress through delaminated parts in plastic encapsulated systems
High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure is adapted to the internal structure of this plastic encapsulated microelectronic part.
Confocal Acoustic Inspection of Optoelectronic Components
An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and...
Inspection of thick EEE plastic encapsulated parts
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.
Alter Technology has upgraded its Scanning Acoustic Microscopy capabilities by acquiring a new FineSAT V acoustic microscope from Hitachi. FineSAT V, the high-end model of the FineSAT series, combines advanced inspection features with the faster inspection speed currently...
Non-destructive internal inspection of EEE parts and passive components
Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems. Typical non-destructive testing activities involving EEE parts are grouped in three main categories: • Functional inspection (electrical...
Scanning acoustic microscopy (SAM), also denominated acoustic micro imaging (AMI) and scanning acoustic tomography (SAT), is a consolidated and recognized tool for non-destructive quality control, inspection and failure analysis in microelectronics components and materials...
Alter Technology GROUP will participate at EMPS (Electronics Materials & Processes for Space Workshops)presenting "Scanning Acoustic Microscopy: Test flow and procedures for the assessment of delamination flaws and historical results review".
C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover it isVirtual LAbmandatory for different applications such as those described below for different sectors.
Scanning Acoustic Microscopy CSAM | EEE Parts
Scanning Acoustic Microscopy (SAM) is an inspection that uses focused sound to investigate, measure, or obtain an internal image of an object. It is commonly used in failure analysis and non-destructive evaluation. The semiconductor industry has found the SAM, particularly the C...