Space and HI-REL Assembly

Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space...

Die Bonding Services

Die Bonding Services Die bonding is the process of attaching a die to substrate/package. Selection of the optimal die attach material and process is based on a number of issues including thermal requirements, electrical requirements and mechanical stability.