Dimas Morilla

Head of Physical Test Laboratory

Trajectory

Since 2004, I have a degree in Physics (Electronics Specialty) from the University of Seville, where I received a special mention to the best academic record of my class. That same year I began my experience as part of the laboratory staff of Alter, so I have developed all my career in the aerospace sector until now, offering quality technical support in some European projects as ATV, Herschel-Planck, Sentinel-3, Bepi-Colombo, Solar Orbiter, Juice, and many others. First of all, as quality and testing inspector; then, from 2011 to 2017 as head of the DPA and FA area, and currently, as Physical Test Specialist. This way, I have high skill and experience in the performance of External Visual Inspection, Seal Test, PIND, Radiographic Inspection, Marking Resistance, Solderability, Terminal Strength, Microsectioning, Internal Visual Inspection, Scanning Electron Microscopy Techniques (including FIB), Material Analysis, Bond Pull, Die Shear, CSAM, Red Plague…

I´ve received specific training in Quality and Reliability of Electronic Components, Specification Systems, Techniques of Analysis for Electronic Devices, Parts Engineering and Component Failure Analysis and Technologic Evaluation among other things. I´m a certified inspector for Pre-Cap test performance and Customer Source Inspection of EEE parts; and by ECSS System for Space Product Assurance: “Crimping of High-Reliability Electrical Connections” in accordance with ECSS-Q-ST-70-26, “Manual Soldering of High-Reliability Electrical Connections” in accordance with ECSS-Q-ST-70-08 and “High-Reliability Soldering for Surface-Mount and Mixed-Technology” in accordance with ECSS-Q-ST-70-38.

Alter Technology Services & Capabilities

Techniques in Electrical, Electronic and Electro-mechanical EEE Components Testing

November 8, 2016

The reliability of the components used in a spacecraft is a determinating factor for their operation and performance throughout the mission life. Only the most advanced techniques are able to provide the depth and accuracy in the inspections required by current state of the art microelectronics.

Residual Gas Analysis – HI Rel Electronics Parts

December 15, 2015

Residual Gas Analysis, also known as Internal Gas Analysis (IGA), is a destructive test which is performed to examine the atmosphere inside hermetically sealed devices. The test procedure is based on milling the component so that the gas content can be extracted and subsequently analyzed.

Scanning Acoustic Microscopy CSAM | EEE Parts

December 9, 2015

Scanning Acoustic Microscopy (SAM) is an inspection that uses focused sound to investigate, measure, or obtain an internal image of an object. It is commonly used in failure analysis and non-destructive evaluation. The semiconductor industry has found the SAM, particularly the C-mode (C-SAM), useful in detecting voids, cracks and delamination within microelectronic packages.

Destructive Physical Analysis DPA | EEE Parts

May 9, 2015

Destructive Physical Analysis, dpa , is a systematic, logical, detailed examination of EEE parts during various stages of physical disassembly. This activity is performed to verify that the manufacturing lot quality and construction are in accordance with the detailed specification and project requirements.