Tin Whiskers grow spontaneously from pure-tinned and electroplated surfaces . They are a conductive hairy-like crystalline structures of, microscopic metal fibers that cause electrical short-circuits and failures, usually as a result of stress of some sort, sometimes is long enough to cause a big problem for some applications demanding high level of reliability.
In this section you will be able to obtain information and real results of how this process occurs and why it is produced. This test has taken place in our laboratories in Alter Technology with precise and concrete results:
STUDIES AND RESULTS
Tin Whisker Growth
The Tin Whisker is a conductive hairy-like crystalline structures of tin that grow spontaneously from a tinned surface, usually as a result of stress of some sort, and maybe long enough to cause a big...
Tin Whisker Growth Experimental Methods
The surface mount device beads under study have two rectangular contacts at opposite sides. With bends of 90 degrees that have an approximate planar surface of 3.048 mm2 each. In order to comply with...
Tin Whisker Growth Results
Tin Whisker Growth Results comes after the investigations and thanks to the methods carried out by Alter Technology, we can reach some conclusions. An important starting point must be stressed that NO...
Tin Whisker Growth Conclusions
This study corroborates that the Nickel (Ni) underlayer recommended by the industry as a diffusion protective barrier of the contact, is effective in delaying Stannum (Sn) whisker growth under ambient...
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