OPTOCAP is a technology oriented company active in the field of optoelectronics, microelectronics and MEMS packaging design and assembly services.

Its turn-key packaging services enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. OPTOCAP works in a wide variety of industrial sectors for which quality and reliability is a must along with an efficient supply chain.

Our expertise in packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This provides customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain.

OPTOCAP will become an integral part of the ALTER TECHNOLOGY GROUP which represents the Aerospace Business Unit in the multinational engineering TUV NORD GROUP.

SERVICES

  • Package Design, modelling and verification
  • Prototype and Pilot assembly
  • Automated volume manufacturing process development
  • Volume sub-contract manufacturing
  • Volume manufacturing process transfer
  • Supply chain management

Reduced Time to Market

  • Utilising Optocap’s standard technology platforms allows customers a significant head start in their product development cycle.
  • No delays for selection and commission of in-house equipment.
  • Rapid prototyping (same day builds for selected parts).

Reduced Technical Risk

  • Optocap’s standard technology platform’s enable customers to avoid important technical pitfalls and avoid costly qualification steps.
  • Prototyping on production toolset ensures no hidden issues for production.

Reduced Product Development and Manufacturing Costs

  • No requirement for equipment/expertise outside customers core IP.
  • Optimised assembly process to reduce build time, improve yields and increase performance.
  • Technology transfer to off-shore volume assembly houses.
  • Reduced material costs by leveraging Optocap’s standard materials and respective economies of scale.

Pure-Play Supplier

  • Optocap is not a product company and hence does not compete with our customers.
  • Provides customer confidence in IP control and protection.

OPTOCAP LIST OF SERVICES 

Chip On Board Assembly

May 18, 2016
chip-on-board
Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a substrate using conductive or non-conductive epoxies. Die are electrically connected using Au ball bonding or Al Wedge Bonding. The die is then protected using a glob top or Dam/Fill encapsulation process. Wire Bonding Section Wire bonding is the main […]

CPV Concentrator Photovoltaic Packaging

May 18, 2016
Photovoltaic Packaging
Optocap has extensive experience the packaging and assembly of Concentrated Photovoltaic (CPV) devices. Optocap offers customers support in both prototype/process development for CPV packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and high yield process. A […]

Failure Analysis Electronic Parts | OPTOCAP

May 17, 2016
optocap failure analysis
Once a product has been design and prototype devices manufactured customers will typically want to ensure that the design, materials and assembly processes are fit for purpose. This will typically involve putting the parts through some level of environmental and functional testing. After this stage it is important that any failure modes are identified and […]

Flip Chip Assembly

May 18, 2016
flip chip assembly
Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.  Once the die is connected the stand-off distance between the die and substrate […]

Laser Diode Packaging

May 17, 2016
laser diode packaging optocap
Laser Diode Packaging Optocap offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and high yield process. A summary of Optocap’s laser diode packaging expertise can be […]

LED Packaging

May 18, 2016
led packaging
Optocap has extensive experience in the packaging high brightness LEDS (HB-LEDS). Optocap offers customers support in both prototype/process development for LED packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and high yield process. A case-study for […]

Microelectronic Packaging

May 18, 2016
Optocap microelectronic-packaging
Microelectronic Packaging Optocap has detailed experience in assembly of a wide range of Microelectronic devices including the following; CMOS Sensors CMOS Camera Modules MEM’s Capacitive, Optical, Isolation structures, pressure sensor MEM’s Sensors Optical sensors/strain gauges OLED Display HB-LED Light Engines RF Modules LCD displays Microelectronic Packaging Optocap also offer fast-turn IC assembly services into a […]

Optical design Optocap

May 11, 2016
optical design optocap
Our capabilities range from the simple selection of a ball lens for coupling the output of an optical fibre into a photodiode, to providing a much wider module design service. This may include proof-of-concept design evaluation, opto-mechanical and thermal tolerancing leading to material selection, and the generation of mechanical piece part drawings through the use of Solidworks.

Optoelectronic Photonic Packaging

May 18, 2016
optoelectronic photonic packaging
Optoelectronic Photonic Packaging A key function of an optoelectronic device is to manipulate light. As a result the packaging and assembly processes for many optoelectronic components can be significantly more complex than traditional microelectronic devices. Optoelectronic or Photonics packaging requires extremely accurate placement of components to ensure appropriate suitable alignment and coupling of light into […]

RF Module Packaging

May 18, 2016
rf module packaging
Optocap offers customers support in both prototype/process development for RF Module packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and high yield process. RF Module Packaging As RF modules run at very high frequencies the effects […]

System In Package

May 18, 2016
system in package optocap
System in Package Incorporates a number of integrated circuits in a single package in a way that maintains the demanding form factor requirements. Optocap offers customers support in both prototype/process development for their System in Package (SiP) requirements as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a […]

OPTOSAT

OPTOSAT

Utilizing the Unicorn-1 Platform for In-Orbit Demonstration and Space Heritage

Alba Orbital  are working with Optocap and Alter Technology to develop the ‘Optosat‘ for Semiconductor in space verification and demonstration.

optocap logo

 

 

5 Bain Square
EH54 7DQ Livingston, Scotland, UK

  +44 (0) 1506403550

  info@optocap.com