Providing contract package design and assembly service
Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to assembled product.
Our process and design IP and know-how enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with any new product development.
Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture.
SERVICES & PRODUCTS
Utilizing the Unicorn-1 Platform for In-Orbit Demonstration and Space Heritage
Alba Orbital are working with Optocap and Alter Technology to develop the ‘Optosat‘ for Semiconductor in space verification and demonstration.
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