Providing contract package design and assembly service

Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to assembled product.

Our process and design IP and know-how enable our customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with any new product development.

Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture.

SERVICES & PRODUCTS

OPTOSAT

OPTOSAT

Utilizing the Unicorn-1 Platform for In-Orbit Demonstration and Space Heritage

Alba Orbital  are working with Optocap and Alter Technology to develop the ‘Optosat‘ for Semiconductor in space verification and demonstration.

optocap logo

 

 

5 Bain Square
EH54 7DQ Livingston, Scotland, UK

  +44 (0) 1506403550

  info@optocap.com

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