Tag - Thermal Cycling

In order to determine the ability of components and welded interconnections to withstand high temperatures, as well as cyclic exposures to extreme temperatures, thermal cycling tests are performed.
As a result of the effect of induced mechanical stress, permanent changes may occur in the physical or electrical characteristics of the tested devices that compromise their short or long term reliability.

Material Processes

Thermomechanical Failures in Plated Through Vias (PTVs)

by Francisco Javier Aparicio Rebollo

Thermomechanical stress in PCB/PWBs is generated by the mismatch between the coefficient of thermal expansion (CTE) of the materials comprising the system. In general laminate material used for PCB fabrication, as well as other dielectric polymers, have larger CTE than metal...

Evaluation / Qualification

Thermal Cycling on Electronic Components | EEE Parts

by Francisco Javier Aparicio Rebollo

determine the ability of parts and solder interconnects to resist extremely low and extremely high temperatures, as well as their ability to endure cyclical exposures to temperature extremes. Permanent changes to the electrical or physical characteristics of the devices under...