Microsectioning or Cross-sectioning is a failure analysis technique (performed during DPA) for mechanically exposing a plane of interest in a die or package for further analysis or inspection. It usually consists of sawing, grinding, polishing, and staining the specimen until the plane of interest is ready for inspection by optical or electron microscopy.

Components are microsectioned after potting in a suitable epoxy resin so that a microscopic examination can be undertaken for the purpose of accurately locating, identifying and characterising all the internal structural features of the samples in order to judge any defects against the criteria of the specification.

Typical components that require microsection are:

  • Diodes
  • Capacitors
  • Relays
  • Isolators
  • Fuses

Radiographic Inspection 3D X Ray – 2D

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Radiographic Inspection electronic components
The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal  such flaws as presence of foreign objects, improper interconnecting...

Cross sectioning Electronic Components | EEE Parts

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Cross sectioning Electronic Components
The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not...

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