Applications Packaging & Assembly Fast-turn IC Assembly by Media ATN Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including; CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA