Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including;
- CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
- QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA
This fast-turn assembly service offers customers a number of significant advantages;
- Fast-turn around – same-day delivery possible
- Flexibility to handle last minute changes and accommodate non-standard die/wire bond layouts.
- No minimum order quantities
- Open Cavity Plastic Package benefits;
- Duplicates production package performance
- Remolding option
- Eliminates special socket requirements
- Accurate performance evaluation/validation of simulations and electrical parameters.
Contact us for more information
This post is also available in: Spanish