Fast-turn IC Assembly

Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including;

• CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
• QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA

This fast-turn assembly service offers customers a number of significant advantages;

• Fast-turn around – same-day delivery possible
• Flexibility to handle last minute changes and accommodate non-standard die/wire bond layouts.
• No minimum order quantities
• Open Cavity Plastic Package benefits;
  • Duplicates production package performance
  • Remolding option
  • Eliminates special socket requirements
  • Accurate performance evaluation/validation of simulations and electrical parameters.