Fast-turn IC Assembly

Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including;

  • CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
  • QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA

This fast-turn assembly service offers customers a number of significant advantages;

  • Fast-turn around – same-day delivery possible
  • Flexibility to handle last minute changes and accommodate non-standard die/wire bond layouts.
  • No minimum order quantities
  • Open Cavity Plastic Package benefits;
    • Duplicates production package performance
    • Remolding option
    • Eliminates special socket requirements
    • Accurate performance evaluation/validation of simulations and electrical parameters.

Contact us for more information

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