chip-on-board

Chip On Board Assembly

Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a substrate using conductive or non-conductive epoxies. Die are electrically connected using Au ball bonding or Al Wedge Bonding. The die is then protected using a glob top or Dam/Fill... Continue reading

led packaging

LED Packaging

Optocap has extensive experience in the packaging high brightness LEDS (HB-LEDS). Optocap offers customers support in both prototype/process development for LED packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can... Continue reading

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Microelectronic Packaging

Microelectronic Packaging Optocap has detailed experience in assembly of a wide range of Microelectronic devices including the following; CMOS Sensors CMOS Camera Modules MEM’s Capacitive, Optical, Isolation structures, pressure sensor MEM’s Sensors Optical sensors/strain gauges... Continue reading

flip chip assembly

Flip Chip Assembly

Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.  Once the die is connected the stand-off... Continue reading

system in package optocap

System In Package

System in Package Incorporates a number of integrated circuits in a single package in a way that maintains the demanding form factor requirements. Optocap offers customers support in both prototype/process development for their System in Package (SiP) requirements as well as... Continue reading

optoelectronic photonic packaging

Optoelectronic Photonic Packaging

Optoelectronic Photonic Packaging A key function of an optoelectronic device is to manipulate light. As a result the packaging and assembly processes for many optoelectronic components can be significantly more complex than traditional microelectronic devices. Optoelectronic or... Continue reading

rf module packaging

RF Module Packaging

Optocap offers customers support in both prototype/process development for RF Module packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a fully optimised and... Continue reading

laser diode packaging optocap

Laser Diode Packaging

Laser Diode Packaging Optocap offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability. By prototyping on the volume manufacturing tool-set Optocap can offer a risk free transition to manufacturing with a... Continue reading

optical design optocap

Optical design Optocap

Our capabilities range from the simple selection of a ball lens for coupling the output of an optical fibre into a photodiode, to providing a much wider module design service. This may include proof-of-concept design evaluation, opto-mechanical and thermal tolerancing leading to... Continue reading