Thermomechanical stress in PCB/PWBs is generated by the mismatch between the coefficient of thermal expansion (CTE) of the materials comprising the system. In general laminate material used for PCB fabrication, as well as other dielectric polymers, have larger CTE than metal...
Electronic Components Thermal shock testing is performed to determine the ability of parts to function properly in an environment with sudden extreme changes in temperature. It is also used for accelerated testing during product evaluation and qualification process. Thermal...
