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Tag - Acoustic Tests C-SAM

Scanning-Acoustic-Microscopy-SAM
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Scanning Acoustic Microscopy on Ceramic Capacitors

by Francisco Javier Aparicio Rebollo

Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts

Crack detection within plastic packages
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Crack detection within plastic packages by C-SAM

by Antonio José Rey

Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive...

Non-destructive detection of micrometric internal features within EEE microelectronic systems.
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Non-destructive detection of micrometric internal features within EEE microelectronic systems.

by Francisco Javier Aparicio Rebollo

Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.

Confocal Scanning Acoustic Microscopy
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Acoustic Inspection of Hybrid Systems on Laminated Substrates

by Francisco Javier Aparicio Rebollo

Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique.

Water ingress through delaminated parts in plastic encapsulated systems using C-SAM
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Water ingress through delaminated parts in plastic encapsulated systems

by Francisco Javier Aparicio Rebollo

High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure is adapted to the internal structure of this plastic encapsulated microelectronic part.

Inspection of thick EEE plastic encapsulated parts
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Confocal Acoustic Inspection of Optoelectronic Components

by Francisco Javier Aparicio Rebollo

An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and...

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