Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts
Crack detection within plastic packages by C-SAM
Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive...
Non-destructive detection of micrometric internal features within EEE microelectronic systems.
Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.
Acoustic Inspection of Hybrid Systems on Laminated Substrates
Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique.
Water ingress through delaminated parts in plastic encapsulated systems
High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure is adapted to the internal structure of this plastic encapsulated microelectronic part.
Confocal Acoustic Inspection of Optoelectronic Components
An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and...