Sample & Method
An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and highlights the delaminated areas. In addition, A-scan inspection is used to confirm these findings.
Remarks
Thorough scanning acoustic inspection discloses defects at different locations. First of all, minor acceptable delamination is observed at the rear side of the paddle. However, the detected delamination on the lead-frame wire bonding area compromises the system performance. On the other hand, one lead is delaminated over its entire length. This delamination extends from the external surface of the package up to the active area and represents a severe risk of water ingress.
Assessment as per different test methods
In Alter Technology Scanning Acoustic Microscopy inspection is conducted in accordance with different inspection methods. Next table summarizes the inspection result for these different criteria.
Contact our team
Since 2007 Dr Aparicio has developed a productive research career within the field of Materials Science including post-doctoral stays at the University of Trento, the University of Mons, and the Spanish National Research Council (CSIC). His researches have been published in more than 30 articles in reputed international research journals and conferences (> 70) including more than 10 invited talks and lectures.
Within the frame of the programme “Torres Quevedo” for the Knowledge Transfer and the incorporation of research talent into the industry, in 2019 he joined Alter Technology as Senior Materials Science Test Engineer. In 2019 he was appointed to lead the Scanning Acoustic Microscopy Service. Within this framework, he currently collaborates in different ESA projects (JUICE and PLATO).”
- Scanning Acoustic Microscopy on Ceramic Capacitors - 18th May 2020
- Non-destructive detection of micrometric internal features within EEE microelectronic systems. - 3rd September 2019
- Acoustic Inspection of Hybrid Systems on Laminated Substrates - 3rd September 2019
