Chip on Board Assembly is the process whereby a bare semiconductor die is mounted on a substrate using conductive or non-conductive epoxies. Die are electrically connected using Au ball bonding or Al Wedge Bonding.
Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.
Alter Technology (formerly Optocap), offers a full range of contract precision assembly processes for semiconductor devices. Optocap's assembly process know-how enables reduced costs and reduced time to market for our customers.
