Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a printed circuit board or substrate using conductive or non-conductive epoxies. For applications which require very high thermal and electrical conductivity, we have a number of semi-sintering epoxies which lend themselves to chip-on-board assembly. Die are typically electrically connected using Au ball bonding or Al Wedge Bonding.
Optocap can also attach a die face-down onto a PCB using flip-chip technology, this can either be using solder balls pre-applied at a wafer level or using our in-house stud bumping process. The die is then protected using a glob top or Dam/Fill encapsulation process. Most chip-on-board assembly can also be combined with our fast-turnaround service.
For a more specialist requirements please contact Optocap for a detailed technical review.
Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to the assembled product.
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