Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad. Continue reading
Tag - direct chip attach
Direct Chip attach is know as well as a chip on board and is the die attach assembly. This assembly technology in Chip On Board (COB), consists in depositing epoxy or silicon protection on the head of the die component for encapsulating and protecting.
The technology chip on board can be used on the Radio-frequency field and through a right combination of assembly technologies is applied to many types of substrates.
We offer this services by our company Optocap in Alter Technology TÜV NORD Group.