Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts
![Crack detection within plastic packages](https://wpo-altertechnology.com/wp-content/uploads/2020/04/Crack-detection-within-plastic-packages-310x232.jpg)
Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive...
![](https://wpo-altertechnology.com/wp-content/uploads/2019/07/Confocal-Acoustic-Inspection-of-Optoelectronic-Components-2-310x232.png)
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.
![CSAM](https://wpo-altertechnology.com/wp-content/uploads/2019/03/04-CSAM-310x232.png)
Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems. Typical non-destructive testing activities involving EEE parts are grouped in three main categories: • Functional inspection (electrical...