C-SAM is a reliable and powerful tool for the non-destructive inspection in different sectors:
Scanning acoustic microscopy (SAM) is essential in the non-destructive screening of potential defects in critical systems. Therefore, space agencies routinely use and require SAM inspection as a mandatory test before the implementation in spacecraft, for instance in the regulations included below. This is so due to the capability to perform detailed and comprehensive internal inspections in complex 3D assemblies.
- NASA: PEM-INST-001
- ESA/SCC Spec No.25200
Defense and Aerospace
Military, aerospace and space applications define the higher quality levels in terms of reliability and durability, even under aggressive environmental working conditions. According to these specifications EEE parts must be systematically analyzed after stress tests by either destructive and non-destructive internal inspections, being SAM one of the preferred screening methods.
- MIl-PRF-123, 31033 & 49470
- MIl-STD-883–Method 2030
- MIl-STD-883–Method 2035
Acoustic microscopy is commonly used in the inspection of materials and composites, including those present in the automotive industry. In addition, microelectronics parts are extending their applications within motor vehicles, where they are providing new functionalities and adding value. Some examples are the implementation of cameras, proximity sensors, engine controls and other systems that have to be able to withstand outdoor environmental conditions. Thorough internal inspection of EEE parts and materials by acoustic microscopy assures the suitable performance for such applications.
- Control devices
- Power electronics
- Sealing systems
- Welded connections
- Soldered systems
- Sintered layers
- Compound materials
Power and energy
Power and energy applications impose high working temperatures. In such devices a suitable thermal management is critical for the system performance. Being the high sensitivity to adhesion issues one the main advantages of SAM, the technique is particularly suitable for the detailed inspection of thermal interfaces of EEE parts conceived for these applications.
- IGBT modules
- Heat sinks
- Thin film multilayer systems (sintered and soldered layers)
- Semiconductor (diodes, transistors, photovoltaics junctions)
In addition to assembly issues, scanning acoustic microscopy is also an advantageous non-destructive analysis technique for the characterization of bulk materials. In fact it is particularly effective for the detection of micrometric air defects (voids in the figure) even within low density materials (plastics and mold compounds) or for the inspection of x-ray opaque system (e.g. metals). The image shows the detection of voids within a ceramic capacitor.
- Ceramic and sintered materials.
- Composites and hybrid materials
- Si ingots and wafers
- Bonded and molded plastics
- Hard metals