Multi-depth Confocal Acoustic of Inspection of thick EEE plastic encapsulated parts
Sample & Method
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.
In the particular case of thick plastic packages D2PAK (TO-263), a thorough and comprehensive inspection is achieved if we perform multi-depth confocal analyses at different focal planes of interest. Such analyses are only possible by making use of low-frequency transducers providing large inspection depth or broadband probes in combination with suitable filters to improve the resolution in the case of shallow features.
| wdt_ID | Component type | Package | Anomaly 1 | Anomaly 2 | Anomaly 3 |
|---|---|---|---|---|---|
| 1 | Silicon power transistor | D2PAK (TO-263) | Leadframe delamination | Voids at the die attack | Paddle delamination |
Remarks
Multi-depth confocal inspection reveals minor and major defects at different inspection planes. These included smaller delamination at the molding paddle interface (green arrow in the circuit side inspection), and voids within the die attach (blue arrow in the non-circuit side inspection). The most remarkable deviation is the delamination observed at the lead frame in the proximity of the wire bonding area (red arrow in the circuit side inspection). All these anomalies are acceptable in accordance with the criteria stated in the specifications J-STD-020E.
Contact us
Since 2007 Dr Aparicio has developed a productive research career within the field of Materials Science including post-doctoral stays at the University of Trento, the University of Mons, and the Spanish National Research Council (CSIC). His researches have been published in more than 30 articles in reputed international research journals and conferences (> 70) including more than 10 invited talks and lectures.
Within the frame of the programme “Torres Quevedo” for the Knowledge Transfer and the incorporation of research talent into the industry, in 2019 he joined Alter Technology as Senior Materials Science Test Engineer. In 2019 he was appointed to lead the Scanning Acoustic Microscopy Service. Within this framework, he currently collaborates in different ESA projects (JUICE and PLATO).”
- Scanning Acoustic Microscopy on Ceramic Capacitors - 18th May 2020
- Non-destructive detection of micrometric internal features within EEE microelectronic systems. - 3rd September 2019
- Acoustic Inspection of Hybrid Systems on Laminated Substrates - 3rd September 2019
