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Tag - Material Analysis

Material analysis is performed to detect and identify materials used in the manufacture of semiconductors, microelectronics components and encapsulates.
These analyses can be made through different techniques, either by microscope, x-rays, ions…
The specific objective of this analysis is the detection of prohibited materials, especially in the finishing of terminals to identify possible reliability problems, such as the appearance of unwanted filaments caused by pure tin finishes.

  • Evaluation / Qualification
  • Material Processes

XPS: X-Ray Photoemission Spectroscopy | EEE Parts

by Francisco Javier Aparicio Rebollo

X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the...

Material Analysis EEE Electronic Components
  • Acceptance tests
  • Counterfeit detection
  • Evaluation / Qualification
  • Failure analysis
  • Relifing
  • Screening

Material Analysis EEE Electronic Components

by Francisco Javier Aparicio Rebollo

Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify...

scanning electron microscope SEM FIB
  • Acceptance tests
  • Evaluation / Qualification
  • Material Processes

Scanning Electron Microscope SEM – FIB Inspections Focused Ion Beam | Hi Rel Parts

by Francisco Javier Aparicio Rebollo

This type of inspection is performed using an electron microscope which produces images of a sample by scanning it with a focused electron beam. Interaction between the electrons and atoms in the sample generates signals that contain information about the sample’s surface...

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