3D-X Ray inspection

Radiographic Inspection 3D X Ray – 2D

Radiographic Inspection 3D X Ray – 2D The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal  such flaws as presence of foreign objects, improper... Continue reading

material analysis electronic component

Material Analysis EEE Components

Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify... Continue reading