High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.
Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space...
Die Bonding Services Die bonding is the process of attaching a die to substrate/package. Selection of the optimal die attach material and process is based on a number of issues including thermal requirements, electrical requirements and mechanical stability.
