Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify... Continue reading
The purpose of this test is to verify that the markings on component parts will not become illegible when subjected to solvents (e.g. during the board cleaning process after parts assembly) or during normal handling, and that the solvents employed for the test will not cause... Continue reading
The purpose of the seal test is to determine the effectiveness of the sealing of components with internal cavities, i.e. to determine their hermeticity. Defective sealing may permit the entrance of contaminants, thus reducing the effective life and reliability of devices. Continue reading
The aim of this process is to verify the conformity of the exterior of electrical, electronic and electromechanical components (EEE parts) with the acquisition document. The following aspects should be considered: Marking Aspect of Materials Workmanship Sealing Leads Feedthroughs Continue reading
The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of coated product as well as control of... Continue reading
