Servicios & Capacidades

Wafer Sawing

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Wafer Sawing is the process of singulating the wafer into individual die ready f...

Stud Bumping

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stud bumping
Au stud bumping requires no Under Bump Metalization (UBM) or special wafer prepa...

Flip Chip

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FLIP CHIP
Flip chip (also known as direct chip attach) is the process whereby a semiconduc...

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