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Tag - acoustic microscopy test

Crack detection within plastic packages
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Crack detection within plastic packages by C-SAM

by Antonio José Rey

Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive...

Non-destructive detection of micrometric internal features within EEE microelectronic systems.
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Non-destructive detection of micrometric internal features within EEE microelectronic systems.

by Francisco Javier Aparicio Rebollo

Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.

Confocal Scanning Acoustic Microscopy
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Acoustic Inspection of Hybrid Systems on Laminated Substrates

by Francisco Javier Aparicio Rebollo

Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique.

Water ingress through delaminated parts in plastic encapsulated systems using C-SAM
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Water ingress through delaminated parts in plastic encapsulated systems

by Francisco Javier Aparicio Rebollo

High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure is adapted to the internal structure of this plastic encapsulated microelectronic part.

Inspection of thick EEE plastic encapsulated parts
  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Confocal Acoustic Inspection of Optoelectronic Components

by Francisco Javier Aparicio Rebollo

An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and...

  • Scanning Acoustic Microscopy C-SAM
  • Short Technical Notes

Inspection of thick EEE plastic encapsulated parts

by Francisco Javier Aparicio Rebollo

High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.

CSAM
  • Scanning Acoustic Microscopy C-SAM

Non-destructive internal inspection of EEE parts and passive components

by Francisco Javier Aparicio Rebollo

Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems. Typical non-destructive testing activities involving EEE parts are grouped in three main categories: • Functional inspection (electrical...

  • Scanning Acoustic Microscopy C-SAM

How it works Scanning Acoustic Microscopy (C-SAM)

by Francisco Javier Aparicio Rebollo

Scanning acoustic microscopy (SAM), also denominated acoustic micro imaging (AMI) and scanning acoustic tomography (SAT), is a consolidated and recognized tool for non-destructive quality control, inspection and failure analysis in microelectronics components and materials...

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