Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify...
The purpose of the inspection is to detect: Manufacturer deviations Handling damages that could affect the device assembly and its final application
PIND ( Particle Impact Noise Detection Test ) testing is performed in order to detect the presence of loose particles inside a device cavity. Loose particle contamination is often caused by dirt, fibers, solder residues and other elements trapped inside the cavity during the...
The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal such flaws as presence of foreign objects, improper interconnecting wires, inhomogeneities in materials...
Residual Gas Analysis, also known as Internal Gas Analysis (IGA), is a destructive test which is performed to examine the atmosphere inside hermetically sealed devices. The test procedure is based on milling the component so that the gas content can be extracted and subsequently...
Scanning Acoustic Microscopy (SAM) is an inspection that uses focused sound to investigate, measure, or obtain an internal image of an object. It is commonly used in failure analysis and non-destructive evaluation. The semiconductor industry has found the SAM, particularly the C...
The purpose of the incoming inspection is to identify potentially non-conforming parts, prior to placing the material in the inventory or moving it to the production flow. All parts and materials subject to receiving inspection are examined in accordance with customer purchase...
