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Tag - Microsectioning inspection

MacroVoids in assembled BGA packages
  • Microsectioning
  • Short Technical Notes

MacroVoids in assembled BGA packages

by MC Lopez

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C.

Constructional Analysis
  • Microsectioning
  • Short Technical Notes

Microsection Inspection / Constructional Analysis

by MC Lopez

Cross-section analysis is a very useful way of determining the construction and material composition of electronic devices. The FP device is potted in epoxy resin. After curing, the sample is sequentially grinded up to reach the plane of interest. Then, the specimen is subjected...

Microsection Inspection - Failure Analysis
  • Microsectioning
  • Short Technical Notes

Microsection Inspection / Failure Analysis

by MC Lopez

Microsection analysis is performed on an assembled through-hole device as a part of failure analysis. Cross-section through the plane of interest can provide helpful information about solder defects, PCB inner layers, and internal construction. As a part of failure analysis, the...

  • Microsectioning
  • Short Technical Notes

Evaluation of PCB

by MC Lopez

The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.

  • Microsectioning
  • Short Technical Notes

Evaluation of Electronic Assemblies

by MC Lopez

Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).

  • Microsectioning
  • Short Technical Notes

Assembled Resistors. Incomplete wetting

by MC Lopez

Resistors assembled to a PCB have been submitted to the ECSS verification program. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

  • Microsectioning
  • Short Technical Notes

Plating Thickness Testing

by MC Lopez

Cross-sectioned pins were metallographic prepared in ALTER TECHNOLOGY Materials & Processes Laboratory, recognized as a recommended facility for such activity by ESA authority (MEMO ESA-TECMSP-MO-013165).

  • Microsectioning
  • Short Technical Notes

Microsectioning inspection of assembled capacitors

by MC Lopez

Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).

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