BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C.
Cross-section analysis is a very useful way of determining the construction and material composition of electronic devices. The FP device is potted in epoxy resin. After curing, the sample is sequentially grinded up to reach the plane of interest. Then, the specimen is subjected...
Microsection analysis is performed on an assembled through-hole device as a part of failure analysis. Cross-section through the plane of interest can provide helpful information about solder defects, PCB inner layers, and internal construction. As a part of failure analysis, the...
The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.
Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).
Resistors assembled to a PCB have been submitted to the ECSS verification program. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).
Cross-sectioned pins were metallographic prepared in ALTER TECHNOLOGY Materials & Processes Laboratory, recognized as a recommended facility for such activity by ESA authority (MEMO ESA-TECMSP-MO-013165).
Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).