Chip on Board Assembly is the process whereby a bare semiconductor die is mounted on a substrate using conductive or non-conductive epoxies. Die are electrically connected using Au ball bonding or Al Wedge Bonding.
Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space...
Wire bonding is the main method of making interconnections between a semiconductor die and a package or substrate. Optocap works closely with our customers at the package design stage to ensure that design for manufacturing techniques are applied and wire bond design rules...
