Wire Bonding Services
Wire bonding is the main method of making interconnections between a semiconductor die and a package or substrate.
Optocap works closely with our customers at the package design stage to ensure that design for manufacturing techniques are applied and wire bond design rules, where possible, are adhered to. This co-design activity is crucial in the development a high yield, fully automated and fully optimized wire bond process.
By controlling and optimizing key wire bond process and material parameters such as ultrasonic energies and wire specification a robust and reliable wire bond processes can be developed.
Our company also offers wire pull and ball shear test data to enable qualification of the wire bond process.
Optocap’s expertise and capability in wire bonding will reduce risk and reduce time to market for your wire bonding requirements as well as providing a cost-effective manufacturing option.
Gold Ball Wire Bonding
Our laboratories offers Gold (Au) ball wire bonding utilizing advanced automated wire bonding equipment.
Wire bond diameters from 17um to 33um can be handled with a capability for fine pitch wire bonding down to 50um.
As an expertise company also utilizes a range of advanced wire bonding techniques including reverse bonding for low loop profiles, die to die bonding and deep access wire bonding in a package to different heights.
Optocap’s Gold (Au) ball wire bonding services are applied to wide range of package types including ceramic packages, open-cavity plastic packages and PCB’s.
Aluminum (Al) or Gold (Au) Wedge Bonding 17 µm to 75 µm diameter wire.
Ribbon Bonding Au up to 50µm X 250µm ribbon. The larger surface area of the ribbon makes it an ideal interconnection option for high speed RF applications and high power devices.
Optocap provides contact package design and precision assembly services for a wide range of optoelectronic, microelectronic and MEMS devices. We offer end to end backend semiconductor manufacturing from wafer singulation to the assembled product.
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