Microelectronic Packaging

Microelectronic Packaging

ALTER UK has detailed experience in assembly of a wide range of Microelectronic devices including the following;

• CMOS Sensors
• CMOS Camera Modules
• MEM’s
  • Capacitive, Optical, Isolation structures, pressure sensor MEM’s
• Sensors
  • Optical sensors/strain gauges
• OLED Display
• HB-LED Light Engines
• RF Modules
• LCD displays

Microelectronic Packaging

• ALTER UK also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including;
  • CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
  • QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA

. This fast-turn assembly service offers customers a number of significant advantages;

• Fast-turn around – same day delivery possible
• Flexibility to handle last minute changes and accommodate non-standard die/wire bond layouts.
• No minimum order quantities
• Open Cavity Plastic Package benefits;
  • Duplicates production package performance
  • Remolding option
  • Eliminates special socket requirements
  • Accurate performance evaluation/validation of simulations and electrical parameters

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