Photonic Integrated Circuit (PIC) Packaging

Optocap have experience in the assembly and packaging of a wide range of Photonic Integrated Circuit (PIC) devices including Silicon PIC and InP PIC devices.

A PIC is a photonic integrated circuit that  integrates multiple photonic functions, such as lasers, detectors, modulators and splitters on a single chip.

Due to the high level of functionality within a PIC devices there are a number of challenges that exist in the assembly and packaging of such devices.

Optocap have developed a range of fibre coupling process for coupling light into and out of Photonic Integrated Circuit devices including the following

  • Fibre array alignment for multiple channel alignment
  • Free-space micro-optic alignment
  • Edge coupled and grating coupled fibre align techniques
  • Laser weld or Epoxy attachment of fibres
  • Precision alignment and attachment of laser or photodiode chips to PIC devices

For electrical interconnection of PIC devices Optocap have experience with Au ball wire bonding , Al and Au Wedge and Ribbon bonding for RF devices.

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