Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive...
![Non-destructive detection of micrometric internal features within EEE microelectronic systems.](https://wpo-altertechnology.com/wp-content/uploads/2019/09/Non-destructive-detection-of-micrometric-internal-features-within-EEE-microelectronic-systems.-1-310x232.jpg)
Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.
![Confocal Scanning Acoustic Microscopy](https://wpo-altertechnology.com/wp-content/uploads/2019/09/Confocal-Scanning-Acoustic-Microscopy-310x232.jpg)
Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique.
![Water ingress through delaminated parts in plastic encapsulated systems using C-SAM](https://wpo-altertechnology.com/wp-content/uploads/2019/07/Water-ingress-through-delaminated-parts-in-plastic-encapsulated-systems.-310x232.jpg)
High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure is adapted to the internal structure of this plastic encapsulated microelectronic part.
![](https://wpo-altertechnology.com/wp-content/uploads/2019/07/Confocal-Acoustic-Inspection-of-Optoelectronic-Components-2-310x232.png)
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.