Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive...
Non-destructive detection of micrometric internal features within EEE microelectronic systems.
Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.
Acoustic Inspection of Hybrid Systems on Laminated Substrates
Hybrid microelectronics within plastic packages are comprehensively inspected thanks to the con-focal resolution provided by the scanning acoustic microscopy technique.
Water ingress through delaminated parts in plastic encapsulated systems
High-current low dropout regulator encapsulated in a TO-263 package is inspected by confocal scanning acoustic microscopy (C-SAM). Probe frequency and inspection procedure is adapted to the internal structure of this plastic encapsulated microelectronic part.
Inspection of thick EEE plastic encapsulated parts
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.
Alter Technology is accredited by ENAC to perform Safety Test of Information Technology Equipment (IEC/EN 60065:2002/ A1:2006/A2:2010/A11:2008/A12:2011). We have the necessary experience and qualification to carry out other safety tests according to several international safety...
Alter Technology has an ENAC accreditation to perform harmonic current emission tests (accreditation number 345/LE 808). Basic standard EN 61000-3-2. The objective of this test is to measure the harmonic currents injected into the public supply system (equipment input current 16...